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Company Profile:

Elite Semiconductor Microelectronics Technology Inc. (ESMT) is a professional IC design company, founded in June 1998 in Taiwan’s Hsinchu Science Industrial Park. The company’s main business includes own brand IC product design, manufacturing, sales and technical services. ESMT successfully went public on Taiwan Stock Exchange.

Right from the beginning, ESMT’s mission has been to become a supplier of all types of memory products and technology. Our specialty DRAM products can be widely used in PC peripheral, home appliances, and consumer, communications systems, with various density and interface specifications(including SDRAM, DDR I / II / III and PSRAM, low-power Mobile DRAM, etc.); In the flash memory segment, ESMT also offers various density and interface type NOR and NAND Flash product families to satisfy customers’ need in developing variety of application system. In addition, due to the growing adoption of System in Package (SiP) in many applications, ESMT has also developed Known-Good-Die (KGD) and Multi-Chip Package (MCP) solutions of our memory products to support all requirements from customers.

To further satisfy various demands from customers, ESMT has expanded its product line to cover non memory market, including analog, mixed-signal and system IC segments in recent years. Current product offering includes power management, audio converter (ADC / DAC), Class D audio Amplifier and wireless SOC ICs.
Technology development has always been the core competency of ESMT, we have excellent design and engineering team developing high quality, cost-effective IC product solutions with advanced process, packaging and testing technology to enhance customer’s competitiveness. In cooperation with our best upstream and downstream partners, ESMT always offers to customers high quality, cost-effective products and services on demand.


Classification Description Link
DRAM SDRAM 16Mb~512Mb, Mobile SDRAM 64Mb~512Mb, DDR1 32Mb~512Mb, Mobile DDR1 64Mb~1Gb, DDR2 128Mb~1Gb, Mobile DDR2 512Mb~2Gb, DDR3(L) 512Mb~8Gb, Mobile DDR3 4Gb, DDR4 4Gb, Mobile DDR4X 8Gb~16Gb
Flash Parallel NOR 8Mb~64Mb, SPI NOR 1Mb~256Mb, SLC NAND 1Gb~8Gb, SPI NAND 1Gb~4Gb
MCP 1G+256M, 1G+512M, 1G+1G, 2G+1G, 2G+2G, 4G+2G, 4G+4G, 8G+8G
eMCP 4G+4G, 8G+8G