SECOS

SECOS

Company Profile:

I. Company Profile and Background

SeCoS Technology Corporation (with its parent company Eris Technology Corporation, Stock Code: 3675) was established on August 16, 1995, led by Chairman Jonathan Chang.

Over the years, through multiple transformations and strategic alignments—evolving from early wafer trading and outsourced subcontracting to establishing automated packaging and testing production lines; securing an investment from Diodes Incorporated in 2011; entering the wafer manufacturing sector via the acquisition of Yea Shin Technology in 2018; and subsequently acquiring Diodes’ Keelung wafer fab in the first half of 2024 and SeCoS in the second half of 2024—the company has continuously driven vertical integration and advanced high-end IDM manufacturing processes.

II. Operational Bases and Organizational Structure

• Corporate Headquarters: Located in Shenkeng, New Taipei City, Taiwan.
• Main Manufacturing Facilities: Includes the Taoyuan Packaging Plant and the Keelung Wafer Plant located in Taiwan.
• Global Service Network: Business and sales partners span across Taiwan, China, other Asian regions, Europe, the United States, South Korea, Japan, Southeast Asia, Turkey, India, Australia, the Middle East, Israel, and more.

III. Professional Fields and Core Technologies

Eris and its brand focus on the research, development, and manufacturing of discrete semiconductor components, positioning themselves as a “professional problem-solving partner”.

• Core Technology Highlights:
  • High-Efficiency and High-Performance System Protection: Includes Transient Voltage Suppressor (TVS) diodes, Electrostatic Discharge (ESD) protection devices, Fast Recovery Epitaxial Diodes (FRED), and buffer rectifiers.
  • Advanced Power Devices: Encompasses planar platinum Schottky diodes, Silicon Carbide (SiC) Schottky diodes, trench MOS Schottky diodes, Split-Gate Trench MOSFETs, and Super Junction MOSFETs.
  • Advanced Packaging and Process Technologies: Actively developing Wafer Level Chip Scale Packaging (WLCSP) and Through-Silicon Via (TSV) interconnection technologies to achieve component miniaturization, reduced inductance, enhanced thermal conduction efficiency, and lower power consumption.

IV. Product Introduction and Application Fields

• Main Product Families:
  • Schottky Diodes
  • Rectifier Diodes (Standard / Fast / Super Fast Rectifiers, Bridge Rectifiers)
  • Transistors and MOSFETs (Metal-Oxide-Semiconductor Field-Effect Transistors, Bipolar Junction Transistors – BJT)
  • Surge Suppression and Electrostatic Discharge (ESD) Protection Devices
  • Thyristors and Zener Diodes
• Application Fields: Products are widely used in diverse scenarios such as automotive electronics (e.g., ADAS, autonomous driving, automotive lighting, dashboards, ABS modules, airbag ECU control), Industry 4.0 and IoT, fast-charging devices, artificial intelligence, 5G communications, consumer electronics, solar systems, servers, networking equipment (routers, switches), power supplies (SMPS), and displays.

V. Quality Policy, ESG, and Business Philosophy

• Quality Certifications: Strictly adheres to international standards, having obtained multiple certifications including ISO 9001, IATF 16949, ISO 14001, ISO 45001, ISO 14064, ISO 14067, VDA 6.3, and MIL-PRF-19500R, while complying with AEC-Q101 automotive standards, RoHS, REACH, and Halogen-Free regulations.
• Business Philosophy: Adheres to the core guideline of providing customers with high-quality services through “first-class equipment, first-class service, and first-class products”.
• ESG Sustainability Achievements: Actively promotes greenhouse gas and water resource management in environmental protection, partnering with Taiwan Cement Corporation (TCC) to reuse waste lamination adhesive to develop eco-friendly bricks, thereby realizing a circular economy; in social contribution, long-term commitment to public welfare projects such as “Plant Hope,” donating medical equipment, and organizing volunteer activities; in corporate governance, continuously advancing fully automated production lines and enhancing corporate governance evaluation performance.

Category	Description
Schottky Diode	◎ Utilizing a barrier formed by a metal-semiconductor junction to produce a rectifying effect, its main characteristics are a low forward voltage drop (Low ) and extremely fast switching speed. Within SECOS’s product lineup (including planar, trench, and Silicon Carbide SiC Schottky diodes), they are primarily used in high-frequency switching power supplies, servers, solar systems, and automotive electronics (such as ABS modules, headlights, and various ECU controls), effectively reducing conduction losses and improving overall energy conversion efficiency.
Rectifier Diode	◎ Including standard rectifiers, fast recovery diodes (FRED), and bridge rectifiers, their main function is to convert alternating current (AC) into direct current (DC). Through automated production lines and strict packaging technologies (such as SMA, SMB, SMC, and DO-218 specifications), SECOS provides high-voltage-resistant and highly stable rectifying solutions, which are widely applied in various power supplies, networking equipment, home appliances, automotive alternators, and diesel vehicle ECU systems to ensure the stability and safety of power transmission.
Transistor and MOSFET	◎ Serving as core switching and signal amplification components in circuits. SECOS offers bipolar junction transistors (BJT) and MOSFET products covering technologies from low-voltage to high-voltage, super junction, and split-gate trench. These components enable rapid switching and precise power control in high-current and high-frequency environments, and are widely utilized in Industry 4.0 equipment, servers, computer peripherals, fast-charging devices, automotive motor drives, and door modules.
Surge Suppression and ESD Protection Devices	◎ Overvoltage and surge protection barriers specifically designed for electronic systems (including Transient Voltage Suppressor TVS diodes and ESD arrays). When circuits encounter sudden high-energy lightning surges, load dumps (such as in automotive environments), or electrostatic discharge released by the human body, these components can rapidly conduct and clamp abnormal high voltages within nanosecond (ns) levels, protecting downstream sensitive integrated circuits and core chips from damage. They are commonly used in communication equipment, automotive electronics, interface ports, and consumer electronics.
Thyristor / SCR	◎ Belonging to high-power semiconductor switching components, they possess bistable (controllable conduction and cutoff) characteristics. In SECOS’s product layout, they are mainly used in industrial and consumer systems that require high-power AC control, phase control, or power regulation (such as large motor control, industrial automation equipment, high-power power supplies, and lighting control systems), enabling stable regulation of high currents and high voltages under harsh environments.